Yes: Fully compliant to TI Green definition. Due to this heat dissipation this ICs eventually end up having high circuitry levels. Mutually exclusive execution using std::atomic? Metric Quad Flat Package. Integrated Circuits might dissipate pretty high levels of heat, especially those which have high pin counts. LQFP VIEW RELATED DOWNLOADS The same benefits as TQFP, in a smaller package Amkor offers a broad line of LQFP (Low-profile Quad Flat Package) IC packages designed to provide the same great benefits as TQFP packaging with a 1.4 mm body thickness. The packaging decides a lot of things. There are a variety of surface-mount packages including SOP, small-outline transistor (SOT), and QFP available in the market. Check out our engineering forums, Why are common mode chokes with 90 ohm @ 100 MHz recommended for USB 2.0 Hi-Speed data lines, Altium PCB Design Solder Mask Missing Issue, Indias first drone traffic management system Skye UTM, How rechargeable batteries, charging, and discharging cycles work. If this two are not accurate then the results will be catastrophic. Both packages are similar in that manufacturers use them in cost-conscious applications. However, the TQFP has shorter leads than the LQFP. HTQFP32 SOT547-2 Not suitable for wave soldering. The overall dimensions of a DIP package depend on its pin count. When the print circuit board joins reflow oven, a number of parts start to heat up quicker than others. QFN packages come in different variations, which include: The plastic molded QFN is, interestingly, one of the cheapest QFN that you can find in the market. These are surface-mounted packages with the leads extended out to the four sides of the package. Very-small Quad Flat Package MQFP. Example: ppm= 1,000,000 * total amount of gold in component (mg) / total component weight (mg), Gold mass = 0.23mg & Component mass = 128mg, 1,000,0000 * 0.23 mg gold / 128mg component = 1,797 ppm. Particle size of this alloy must be suitable for solder-stencil apertures dimensions printing. Printed circuit board design and construction are key factors for achieving solder joints with high reliability. LQFP is a low profile (1.4mm) version of the QFP. SMD devices such as rectangular transistors are available in SOT packages. Secondly, it protects the circuit from corrosion. PQFP (Plastic Quad Flat Package) is a form of chip packaging. It restricted the following substances at the homogenous (material) level with associated maximum thresholds. pad package are proposed to improve the solder joint reliability in order to meet customer stringent requirement. The leads are possible in different shapes like linear, mutual folding, L-shape, J-shape, electrode bud, needle shape, solder bud, tape/film shape. PQFP. Low profile and thin quad flat packages (QFP) are classified by Maximum Seated height according to JEDEC definition: Low type (>1.20 mm and <=1.70 mm) and thin type (>1.00mm and <=1.20 mm) but the pitch and package size can vary within each. The exposed pad is an extra pad underneath or on top of the QFP that may act as a ground connection and/or as a heat sink for the package. 505 Xinhua Road Xinhua District, Shijiazhuang Hebei China. TO-XX: wide range of small pin count packages often used for discrete parts like transistors or diodes. The terminals are either J-leaded or leadless. QFP (Quad Flat Package) is a quad flat package, a surface mount package with pins leading from all four sides in a seagull wing (L) shape. Regular QFP are 2.0 to 3.8 mm thick depending on size. QFPs come in two shape variations, rectangular and square: QFP packages have two sections: the top and bottom sections. Introduction Exposed pad in QFP packages are getting more popular in automotive industry as compare to BGA and QFN because of their excellent thermal performance and better . Additionally, you can purchase them in different die types. And because of their fine pitch, it becomes close to impossible to repair a device having bent pins. When working with a PCB design or editing software, you may notice that both the LQFP and TQFP have the same footprint. SMD components widely use these packages. Low Profile Quad Flat Pack (LQFP) is a surface-mount IC package with leads extending from all around four sides of the package body. The first one is if the component can be used on a prototyping board, PCB, or both. These features make them suitable for higher frequency applications. Um Quad Flat Package ( QFP ou encapsulamento quadrado) um encapsulamento de circuito integrado com terminais que se estendem de cada um dos quatro lados. What is the difference between TQFP48 and LQFP48 - Page 1 - EEVblog The components and ICs having surface-mount packaging are called surface-mount devices (SMD). Can I tell police to wait and call a lawyer when served with a search warrant? Since then, there have been several updates to the Directive, the major ones being 2011/65/EU on 8 June 2011 that recasted exemptions expiring in 2011 to future dates (most in 2016). Enough to scare off, all those fancy terms DIP, SIP, SOP, SSOP, TSOP, MSOP, QSOP, SOIC, QFP, TQFP, BGA, etc., are all names different IC packages. Package is finished with a nickel plus a thick gold layer, except where the leads are soldered and decoupling capacitors are soldered on top of the package. The number of pins that a QFP can accommodate means that you should take a lot of care when designing PCBs. PTH was introduced to work with printed circuit boards having tracks on both sides and inner layers. The first step of the QFN-PCB assembly process has got to be solder printing. TQFP QFP Thin Quad Flat Package - Amkor Technology What video game is Charlie playing in Poker Face S01E07? Package. It is an SMD with all DIP pins bent outwards and shrunk down to size. LQFP/TQFP - Orient Semiconductor Electronics These features make them suitable for higher frequency applications. This package allows IC packaging engineers, component specifiers and systems designers to solve issues such as increasing board density, die shrink programs and thin endproduct profile. But you confirmed what I suspected, TQFP can be placed on a QFP land pattern IF they have the same pitch :). Quad Flat Package - 2D PCM Schematics - 3D Model - PARTcommunity Thermocouples help you monitor QFN surface temperature. Print. The leads are arranged in two parallel rows along the package length hanging vertically downwards. PLCC is QFJ of plastic, and the . While the TQFP has a height less than 1.2mm. QFPs have small parasitic parameters, and they are also pretty tiny in size. Short story taking place on a toroidal planet or moon involving flying. This is an even smaller version of the SOIC package. Ultimately, the distinctions between these two packages are so subtle that it barely makes a difference which one you choose. QFJ. QFN Leads extends on all four sides of the QFN package, QFP Leads extends out in a gull-wing shape or an L-shape, QFN The average footing for QFN packages occurs during the PCB assembly procedure, QFP Lead form has an excellent base for the QFP package even during the PCB assembly procedure, QFN These packages have only eight pins in total, plus a thermal pad, QFP These packages, on the other hand, have multiple pins ranging from eight pins per side to seventy pins per side. Nevertheless, please get in touch with us if you have any PCB fabrication inquiries and want to learn more about these topics. See, when it comes to reducing fault rates in reflowing and placement, they tend to encounter some challenges. QFP integrated circuits vary in terms of formats and also in terms of the number of pins utilized. As its name implies, the LQFP (low-profile quad flat ) is a low-profile quad version of the regular quad flat package. And when I Google there is no usable TQFP land pattern to find. rev2023.3.3.43278. packages - TQFP vs QFP landpattern - Electrical Engineering Stack Exchange To achieve this, QFN utilizes SMT (surface-mount technology). 2 . In production, is there a significant difference between QFN or TQFP components other than space? EXAMPLE: Lead (Pb) in leadframe example: (mass of Lead: 0.006273 mg / total mass of leadframe: 62.730001mg) * 1,000,000 = 100 ppm, Quality, reliability & packaging data download. Smaller variants of the standard QFP package include thin QFP (TQFP), very-thin QFP (VQFP), and low-profile QFP (LQFP) packages. Some QFP packages have an exposed pad. This IC has two parallel rows of pins extending perpendicularly out of a rectangular plastic housing. Amkor's TQFPs are an ideal . In flip chip systems the IC is connected by solder bumps to a substrate. CERQUAD packages are the "low cost" alternative for CQFP packages, and are mainly used for terrestrial applications. While you are at it, you can take things upper a notch by checking for contaminants on the boards surface that might hinder the soldering method. Two methods are used in order to make the hermetic sealing: eutectic gold-tin alloy (melting point 280C) or seam welding. Even though QFNs are pretty awesome, they bear some snags, which include: If you are a PCB designer, then you probably know that QFN manufacturability is a crucial factor to consider. It also makes these packages pretty reliable when it comes to packaging the central processing unit (CPU). 1. Other special variants include low-profile QFP (LQFP) and thin QFP (TQFP).[2]. Advanced ICs are available in BGA packages. SMT has almost overtaken the through-hole packaging. The third way the IC packages can be further classified is their terminal (pin) shape. This is an important consideration for both IC designing as well as PCB designing. DPAK (TO-252, SOT-428): Discrete Packaging. A QFP is a surface-mounted IC (integrated circuit) package having gull-wing like leads extending on either side of their four edges. The single row configuration QFN packages are formed using the following processes: Both of these procedures split up an extensive package collection into solitary packages. And on top of that, it also has heat spreaders which allow higher power levels dissipation to improve efficiency. Also, make sure the bond pad design lies at a range of 0.2 0.3 away from your package footprint. Body sizes range from 77 mm to 28 x28 mm. specified land pattern in datasheet. The packaging mainly serves three purposes first, it protects the semiconductor circuit from physical impairment or damage. Dual in-line packages are handy to use on breadboards and prototyping boards. Wettable Flanks QFNs have an elevation reflecting solder wetting. Further revisions continue to be released and TI will maintain its documentation and requirements as they are released, including information on exemptions that may be required. Spacing between pins can vary. They have impressive electrical performance, Their semiconductor package is not expensive. a TQFP-101). Thank you, I'm aware of the different pitch variations. For WEEE, ppm calculations are at the component level. Quad Flat Package (QFP): QFP emerged as the new generation high density surface mount solution to the cost pressure on the electronic component manufacturers and users. Spacing between pins can vary; common spacings are 0.4, 0.5, 0.65 and 0.80mm intervals. Lead counts range from 32 to 176. It is mounted directly to the PCB using bonding wires and covered with a blob of black Epoxy. QFP (Quad Flat Package) Definition. All ICs are linear, rectangular, or square in shape. Since QFN packages have narrow pad-to-pad pitches, this poses a soldering issue known as solder-bridging. What is the difference between VQFP, HVQFP, TQFP & PQFP? QFP technology smoothens IC operations. A QFP IC can have pins anywhere from eight per side (32 total) to upwards of seventy (300+). In beam-lead technology, the metallized pads that would be used for wire bonding connections in a conventional chip are thickened and extended to allow external connections to the circuit. May vary by manufacturer, but T usually means Thin, so lower profile package. The number after QFP indicates the . SOIC package is shorter and narrower than DIP. Similar to SOIC, the SOP family has a smaller form factor, with pin spacing of less than 1.27mm. You can use an accuracy and precision tool to accurately fit your component, even with the excessive interconnection density issue. This exposed pad also gives a solid ground connection. The common quadruple inline packages are QIP/QIL (Quad In-line) and QUIP (ceramic leadless QIP). Soldering your QFP in an atmosphere full of nitrogen can improve the solder joints quality. Hereby the leads are soldered on top of the package. All sorts of circuits analog, digital and mixed-signal, and all types of components passive or active can be integrated into an IC. Everything you want to know about India's electronics industry, South Asia's Most Popular Electronics Magazine. Body Size Range: 5 mm x 5 mm to 20 mm x 20 mm, Available Lead Pitches: 0.4 mm, 0.5 mm, 0.65 mm, 0.8 mm, 1.0 mm. It is very popular in Quad Flat Packs. Ceramic QFP packages come in two variants, CERQUAD and CQFP: Hereby the leadframe is attached between two ceramic layers of the package. The Fundamental Analysis of QFP vs QFN Packages - RayPCB The packaging of an integrated circuit is as important as the integrated circuit, the semiconductor device within. The current language is English.Forward to English site? Chip on board is a packaging technique that directly connects a die to a PCB, without an interposer or lead frame. Do I need a thermal expansion tank if I already have a pressure tank? The component has leads that are soldered to pads on the PCB to electrically and mechanically connect them to the PCB. Regular QFPs may display up to 4.0 mm of thickness. SSOP : 0.65mm/0.80mm/ 1.00mm LQFP : 0.40mm/0.50mm The following guide hopes to answer these questions. They have a height of 1mm and a standard lead-frame footprint of 2.0mm. The LQFP is a leadframe based, plastic encapsulated package with gull wing shaped leads on four sides. Since QFNs are small in size, you can place them close to the board components. LQFPs help to solve issues, such as increasing board density, die shrink programs, thin end-product profile and portability. LQFP (Low Profile Quad Flat Package) LQFP is a kind of QFP whose package body thickness is 1.4 mm and this is the name used by the Japanese Electronics and Machinery Industry according to the new QFP shape specification. Like Liked Unlike. 144-pin low profile quad flat package (LQFP), 80-pin thin quad flat package (TQFP) PIC microcontroller, 304-pin plastic quad flat package (QFP) with exposed thermal pad (TP), 100-pin bumpered quad flat package (BQFP) Cyrix Cx486SLC, 80-pin ceramic quad flat package (TQFP) ST6 microcontroller. In this step, we seek to confirm the quality of the solder. We use our own and third-party cookies to personalize content and analyze web traffic. Um Zilog Z80 num encapsulamento QFP de 44 pinos (acondicionamento especial: LQFP ). Integrated circuits are put into protective packages to allow easy handling and assembly onto printed circuit boards and to protect the devices from damage. One side might have more pins compared to another. Youtube channel :Taking wierd stuff apart. A body molded using plastic (opened and without any seal), QFN packages do not have the problem of lead co-planarity, They have tiny footprints; this helps in terms of saving space, These packages utilize regular surface mounting equipment for print circuit board assembly, These packages are relatively thin (they are less than 1mm). LQFP QFP Low Profile Quad Flat Package - Amkor Technology This package is the main package used for Space projects. The hang-out for electronics enthusiasts. Logged. The WEEE Directive (Waste Electrical and Electronic Equipment) has created interest in recyclable metals. Bare die supplied without a package. The final step in creating a semiconductor device is integrated circuit packaging, which involves encasing the semiconductor material block (on which a given functional circuit isfabricated) in a protective case to protect it from physical harm and corrosion. It's quite easy to solder these packages and easy enough to probe the individual pins afterwards when testing also. Another side for pin pitch size 0.8mm can be used to convert SOP32, SSOP32 to DIP 2.54mm. You can therefore do the direct soldering of the packet onto your PCB when you wish to gain optimum transfer of heat from your die. Find all TI packages | Texas Instruments These QFNs are composed of three sections, namely: These QFNs are pretty pricey compared to other QFNs due to their construction. First off, let us look at the QFN packaging, and then we shall move on to the QFP later on. TQFP - Thin Quad Flat Pack TQFPs are more available in smaller packages, while LQFPs are easier to attach to your PCB. Such wire may then be covered with cotton, glass or other materials to make into smart textiles or electronic textiles. These two sections are then glued together to form a complete QFP package. If you update your question with the part it might be possible to help further. Then you should automatically know that it is plastic. There's a standard IPC-7351A which describes method to design land patters. J shape. Well, here is how. Polybrominated biphenyls (PBB): 0.1% (1000ppm), 6. QFP pins are pretty small, plus they have small spacings. 0.1in (2.54mm) pin spacing, rows 0.3in (7.62mm) or 0.6in (15.24mm) apart. Most ICs with 6 to 40 pins have at least DIP as one package type. This makes it easier to mount than TQFP. LQFP package having total height less than 1.7mm (including 1.7mm) and more than 1.2mm (no including 1.2mm), said package named Low profile Quad Flat Package. QFPs are surface mounted and can be thermally enhanced through an exposed pad. They can have different pin pitch (the distance between pins) and perhaps even a different package size. After that, sort the sawn types to conclude the process of creating a sawn-type QFN package. Using the socket allows for the DIP IC to be removed from and inserted into the PCB easily. The discrete form is reserved for standalone components only, like a transistor, diode, resistor, capacitor, or inductor. Use MathJax to format equations. Most common LGAs are used as a physical interface for microprocessors. IC Package Types | DIP, SMD, QFP, BGA, SOP, SOT, QFN, SOIC They define pin spacing and et cetera in terms of imperial dimensions rather than metric dimensions. Electrical Engineering Stack Exchange is a question and answer site for electronics and electrical engineering professionals, students, and enthusiasts. Then, a punch tool splits the molded cavity. TQFP vs LQFP: What is the Difference Between Packages The basic form is a flat rectangular (often square) body with leads on four sides but with numerous variation in the design. A package related to QFP is plastic leaded chip carrier (PLCC) which is similar but has pins with larger pitch, 1.27mm (or 1/20inch), curved up underneath a thicker body to simplify socketing (soldering is also possible). Quad Flat Package (QFP) Microcontroller Socket Market - Global Industry To . HVQFP - Heatsink Very thin Quad Flat Pack. These packages utilize ceramic which improves their quality and also their efficiency. Though for commercial use, those ICs may be available in surface-mount packages. This is a different technology referred to as Surface-Mount Technology (SMT). The portfolio covers from 16 Kbytes to 1 Mbyte of Flash with motor control peripherals, USB full-speed interface and CAN. Mounting style is one of the obvious distinguishing factors in ICs. It is suitable for applications where height and weight are critical factor.LQFP package having total height less than 1.7mm (including 1.7mm) and more than 1.2mm (no including 1.2mm), said package To convert mm to mils, divide mm by 0.0254 (i.e., 2.54mm / 0.0254 = 100 mil). This question is closed. Dibutyl phthalate (DBP): 0.1% (1000ppm), 10. Low profi le Quad Flat Package VQFP. This makes it easier to mount than TQFP. There are many IC packages, and most of the ICs come in more than one package. TO determine the soldering paste volume to use, you should check on the stencil thickness and the stencil aperture. The pinout can be linear, in two parallel directions, all four sides, or matrix form. The quad flat-pack has connections only around the periphery of the package. Copyright 2023 WTWH Media LLC. Very-small Quad Flat Package MQFP. BGA packages are found on pcDuino and Raspberry Pi boards. The IC packaging is all about encasing the semiconductor die and taking out macroscopic electrical contacts for interconnections on a PCB. The measurement should hence be pretty accurate. A hot air system having top and bottom heaters utilized to remove components. QFP solder joint temperature can be affected by a couple of things: For power packages whereby shortage and leakage current below the QFP are a factor to, you should solder using less flux spread. They also check the package body temperature does not surpass any typical values. The nature of simulating nature: A Q&A with IBM Quantum researcher Dr. Jamie We've added a "Necessary cookies only" option to the cookie consent popup. PQFP packaging information from Integrated Silicon Solution, Inc. https://en.wikipedia.org/w/index.php?title=Quad_flat_package&oldid=1140003139, This page was last edited on 17 February 2023, at 23:37. System-in-Package (SiP) Solutions; LIN Functional Safety; Back; Browse USB; Basic USB Concepts and FAQs; USB Hubs; USB-C Power Delivery Controllers; USB Bridge Controllers; USB Switches and Transceivers; USB Graphics Controllers; USB Port Power Controllers; USB MCUs and dsPIC DSCs; Back; Browse Serial EEPROM; MAC Address and Unique ID EEPROMs Square they have the same number of pins on each side as they have the same length. Why have the same chip in the same package, but with a different number of pins? TQFP packages range from 32 pins with a 0.8mm lead pitch, in a package 5mm by 5mm by 1mm thick, to 256 pins, 28mm square, 1.4mm thick and a lead pitch of 0.4mm.[2]. Pins on a QFP IC are usually spaced anywhere from 0.4mm to 1mm apart. The Thin Quad Flat Pack, or TQFP, is a surface-mount IC package with gull wing leads on all four sides of the package body. It is better to design own land pattern based on your design requirements. The common flat pack IC packages are QFP (Quad Flat Package), TQFP (Thin Quad Flat Package), STQFP (Small Thin Quad Plastic Flat Package), FQFP (Fine-pitch Quad Flat Package), HQFP (Quad Flat Package with Heat sink), LQFP (Low profile Quad Flat Package), VQFP (Very-small Quad Flat Package), MQFP (Metric Quad Flat Package), BQFP (Bumper quad flat-pack), ETQFP (Exposed thin quad flat-package), PQFN (Power quad flat-pack), PQFP (Plastic quad flat-package), QFJ (Quad Flat J-leaded package), QFN (Quad Flat Non-leaded package), TQFN (Thin-Quad Flat No-Lead Plastic package), DFN (Dual Flat package), QFI (Quad Flat I-leaded package), HVQFN (Heat-sink very-thin quad flat-pack, no-leads), VQFN (Very-thin quad flat, no-lead), WQFN (Very-very-thin quad flat, no-lead), UQFN (Ultra-thin quad flat-pack, no-lead), and ODFN (Optical dual flat, no-lead). What is QFP (Quad Flat Package)? - Electrical Information I know these packages have different thickness, but I have a hard time to find a TQFP landpad spec. This package type was introduced to increase the package density of DRAM. It is relatively common to find packages that contain other components than their designated ones, such as diodes or, List of integrated circuit packaging types, Transistor, diode, small-pin-count IC packages, Learn how and when to remove this template message, "CPU Collection Museum - Chip Package Information", "Integrated Circuit, IC Package Types; SOIC. List of integrated circuit packaging types - Wikipedia Thin Quad Flat packages TQFPs are a low-profile QPF variation. Quad flat package - Wikipedia TQFPs are more available in smaller packages, while LQFPs are easier to attach to your PCB. Lead count ranges from thirty-two to two hundred and fifty-six, Body size ranges from 28 x 28 millimeters to 5 x 5 millimeters, Lead pitches comes in four different variations: 0.3, 0.4, 0.5 and 0.65mm, They let the QFP package bear high density compared to rectangular packages, During transportation, these QFPs are damaged easily compared to rectangular packages. The LQFP comes in different body sizes, with lead counts ranging from 48 to 216. vegan) just to try it, does this inconvenience the caterers and staff? Circuit Board Fabrication and PCB Assembly Turnkey Services WellPCB - Circuit Board Fabrication and PCB Assembly Turnkey Services, 3rd Floor, Nanhai Plaza, NO. Maximum pin count is 352 pins. Their positioning and size makes them vulnerable to damage that is hard to fix. Occasionally specially-processed integrated circuit dies are prepared for direct connections to a substrate without an intermediate header or carrier. [1] Socketing such packages is rare and through-hole mounting is not possible. PQFP packaged chips have pins on all sides, and the total number of pins is generally more than 100, and the distance between the pins is very small, and the pins are also very thin. 4. This package requires a carefully designed PCB concerning electromagnetic compatibility. So far, we have more than 4,000 customers worldwide. Very small outline package (VSOP): even smaller than QSOP; 0.4-, 0.5-, or 0.65-mm pin spacing. The STM8S105x4/6 access line 8-bit microcontrollers offer from 16 to 32 Kbyte Flash program memory, plus integrated true data EEPROM. Copper lead-frames are used for this dummy component package. Whats even worse is that this problem seems to affect two major areas: Therefore, when dealing with stencil designs, you must have accurate stencil thickness and aperture design. They are used for mainstream cost sensitive applications. Versions ranging from 32 to 304 pins with a pitch ranging from 0.4 to 1.0 mm are common. Is it using the same landpad as for QFP (reflow soldering)? Your happiness as a customer is my priority! The STM8S microcontroller family reference manual (RM0016) refers to devices in this family as medium-density. However, some smaller QFPs might have only thirty-two pins, which means they have eight pins on either side. After solder paste printing, you can then move on to embedding your QFN integrated circuit onto your PCB based upon your PCB layout design. Most of the vendors and IC suppliers provide a tabulation of IC packages by first classifying the packages by the number of terminal rows (single row, dual row, quad row, grid array, and unpackaged), then further ramify the packages by mounting style (through-hole and surface-mount), terminal shape and terminal dimensions sequentially. Quad Flat J-leaded package QFP . I'm not sure what the difference is between two, other than L stands for Low. The ceramic QFP comes in many body sizes, with lead counts typically ranging from 28 to 352. Redoing the align environment with a specific formatting. Well, in this article, we shall look at QFN and QFP in detail. To increase the number of pins, the spacing was decreased from 50 mil (as found on small outline packages) to 20 and later 12 (1.27mm, 0.51mm and 0.30mm respectively). Variation of COB, where a chip is mounted directly to a flex circuit. Furthermore, QFNs come with an open thermal pad fixed below the package. TQFP vs LQFP: What is the Difference Between Packages #package #TQFP #LQFP #ic The bond diagram shows an example for a 16 pin QFN. Remember to follow the manufacturers guidelines when soldering to achieve an optimal output. LQFP can have higher lead counts, and its leads are longer. Each pin is usually spaced about 1.27mm from the next. What is an Inductor Impedance Calculator? So with that in mind, you can utilize thermocouples to accomplish the whole process and attain better results. A QFP or Quad Flat Package is a surface mount integrated circuit package with "gull wing" leads extending from each of the four sides. Next, you have to de-solder (keep the temperature profile of your component and the board in mind). Is it possible to create a concave light? Comprehensive Analysis of IC Packaging Packages Types The Low Profile Quad Flat Pack, or LQFP, is a surface-mount IC package with leads extending from all four sides of the package body. . Electronic components are available either in discrete or integrated form. The most common pin counts are four, six, eight, fourteen, eighteen, twenty, twenty-eight, and forty pins. The QFP component package type became common in Europe and United States during the early nineties, even though it has been used in Japanese consumer electronics since the seventies. pjr . Main ceramic package manufacturers are Kyocera, NTK, and offer the full pincount range. The leads are arranged horizontally in two or four rows with surface-mount style.